FEATURES
High Tg: ≥190℃(TMA) / ≥200℃ (DMA)
Ultra Low Loss
Excellent thermal resistance, Td≥340℃
Low Z axis CTE
Low water absorption, excellent anti-CAF, high reliability
Compatible with Lead-ree process
APPLICATIONS
Server
Switch
Router
Measuring instrument
GENERAL PROPERTIES
Item | Test Condition | Unit | Spec | Typical value | |
TG | TMA | ℃ | ≥170 | 185 | |
DMA | ℃ | ≥190 | 207 | ||
Peel Strength (HVLP2 1oZ) | 288℃,10s | N/mm | \ | 0.57 | |
Peel Strength (HTE 1oZ) | 288℃, 10S | N/mm | \ | 0.71 | |
Thermal stress | 288℃,solder dip | S | >10 | 180s No delamination | |
Flexural Strength | Warp | N/m㎡ | ≥415 | 500 | |
Fill | ≥345 | 480 | |||
Flammability | E 24/125 | - | UL94V-0 | V-0 | |
Surface Resistivity | After moisture | MΩ | ≥1.0x104 | 1.0x108 | |
Volume Resistivity | After moisture | MΩ·cm | ≥1.0x106 | 1.0x109 | |
Dielectric Constant (L1-Glass RC58%) | 10GHZ C 24/23/50 | - | \ | 3.45 | |
Loss Tangent (L1-Glass RC58%) | 10GHZ C 24/23/50 | - | \ | 0.0021 | |
Arc Resistance | D 48/50+D 0.5/23 | S | ≥60 | 120 | |
Dielectric Breakdown | D 48/50+D 0.5/23 | KV | ≥40 | 62 | |
Moisture Absorption | D 24/23 | % | ≤0.2 | 0.08 | |
Td | Weight Loss 5% | ℃ | ≥340 | 403 | |
CTE in XY/Z Axis | Alpha1 | TMA
| ppm/℃ | ≤45 | 40 |
Alpha2 | ppm/℃ | ≤260 | 180 | ||
50 - 260°C | % | ≤2.8 | 2.0 | ||
CTE X-axis | TMA | ppm/℃ | \ | 11 | |
CTE Y-axis | TMA | ppm/℃ | \ | 12 | |
T300(Unclad) | TMA | Min | ≥2 | >60 | |
Specimen thickness :0.75mm(2116 E-Glass)