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HSD7JA(K)

FEATURES

High Tg,high reliability

Ultra Low Loss,Low Z axis CTE

Excellent thermal resistance

Low water absorption,excellent anti-CAF,high reliability

Compatible with lead-free


APPLICATIONS

Servers,Switch

Base Station,Millimeter Wave Radar for Automotive

High Performance Computing


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

Glass Transition Temperature (Tg)

DMA

≥200

217

Peel Strength 1oz

HVLP2 As Received

N/mm

\

0.71

Thermal stress

288, solder dip

S

>10

>180s No delamination

Flexural Strength

LW

N/m

 

≥345

510

CW

≥345

460

Flammability

E 24/125

-

UL94V-0

V-0

Surface Resistivity

After moisture

21.0x105

1x108

Volume Resistivity

After moisture

MΩ·cm

≥1.0x106

1x1010

Dielectric Constant

10 GHz Stripline Method

-

\

3.17

(L1-Glass Rc68%) Loss Tangent

10 GHZ Cavity Resonator

-


0.0019

(L1-Glass Rc68%)Arc Resistance

D 48/50+D 0.5/23

S


120

Dielectric Breakdown

D 48/50 +D 0.5/23

kV


>50

Moisture Absorption

D 24/23

%

≤0.2

0.06

Td

Weight Loss 5%

≥340

410

CTE in XY/Z Axis

Alpha1

TMA

ppm/

≤45

45

Alpha2

ppm/

≤260

240

50 - 260°C

%

≤2.8

2.5

T288(Unclad)

TMA

min

15

>60

T300 with Cu

TMA

min

≧2

>60

 

u  Specimen thickness :0.750mm

u  Specification sheet:IPC-4101E/102,is for your reference only

u  Explanation: C: Humidity conditioning D: Immersion conditioning in distilled water

E: Temperature conditioning