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H185HF

FEATURES

High Tg, Halogen free

Low Loss

Excellent Thermal Resistance

Low Z axis CTE

Low water absorption, excellent anti-CAF, high reliability

Compatible with Lead-free process


APPLICATIONS

Switch

Server

Router

Measuring instrument


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

Tg

DSC

≥170

178

Tg

DMA

≥170

175

Peel Strength 1oz HTE

288,10S

N/mm

0.7

1.05

Peel Strength 1oz RTF

Thermal stress

288℃,10S

N/mm

0.7

0.80

288℃, solder dip

S

>10

180s No delamination

Flexural Strength

Warp

N/m㎡

≥415

630

Fill

≥345

520

Flammability

E 24/125

-

UL94V-0

V-0

Surface Resistivity

After moisture

≥1.0x104

2.52x108

Volume Resistivity

After moisture

MΩ·cm

≥1.0x106

4.13x109

Dielectric Constant(RC50%)

10GHZ C 24/23/50

-

\

3.9

Loss Tangent(RC50%)

10GHZ C 24/23/50

-

\

0.007

Arc Resistance

D 48/50+D 0.5/23

S

≥60

135

Dielectric Breakdown

D 48/50+D 0.5/23

KV

≥40

65

Moisture Absorption

D 24/23

%

≤0.8

0.12

Td

Weight Loss 5%

≥340

385

CTE in XY/Z Axis

Alpha1

TMA

ppm/

≤60

35

Alpha2

ppm /

≤300

200

50 - 260°C

%

≤3.0

2.2

T288(Unclad)

TMA

min

≥15

>60

 

u  Specimen thickness :1.0mm

u  Specification sheet:IPC-4101E/130,is for your reference only.

u  Explanation: C: Humidity conditioning D: Immersion conditioning in distilled water

u  E: Temperature conditioning