FEATURES
High Tg: ≥190℃(TMA) / ≥200℃ (DMA)
Extreme Low Loss
Excellent thermal resistance, Td≥340℃
Low Z axis CTE
Low water absorption, excellent anti-CAF, high reliability
Compatible with Lead-ree process
APPLICATIONS
Server
Switch
Router
Measuring instrument
GENERAL PROPERTIES
Item | Test Condition | Unit | Spec | Typical value | |
TG | TMA | ℃ | ≥190 | 199 | |
DMA | ℃ | ≥200 | 226 | ||
Peel Strength(HVLP3 HOZ) | 288℃, 10S | N/mm | ≥0.4 | 0.55 | |
Peel Strength (HTE HOZ) | 288℃, 10S | N/mm | ≥0.5 | 0.61 | |
Thermal stress | 288℃,solder dip | S | >10 | 180s No delamination | |
Flexural Strength | Warp | N/m㎡ | ≥415 | 455 | |
Fill | ≥345 | 425 | |||
Flammability | E 24/125 | - | UL94V-0 | V-0 | |
Surface Resistivity | After moisture | MΩ | ≥1.0x104 | 3.72x108 | |
Volume Resistivity | After moisture | MΩ·cm | ≥1.0x106 | 4.93x109 | |
Dielectric Constant (L1-Glass 1078*2 RC70%) | 10GHZ C 24/23/50 | - | \ | 3.25 | |
Loss Tangent (L1-Glass 1078*2 RC70%) | 10GHZ C 24/23/50 | - | \ | 0.0014 | |
Arc Resistance | D 48/50+D 0.5/23 | S | ≥60 | 135 | |
Dielectric Breakdown | D 48/50+D 0.5/23 | KV | ≥40 | 65 | |
Moisture Absorption | D 24/23 | % | ≤0.8 | 0.10 | |
Td | Weight Loss 5% | ℃ | ≥340 | 385 | |
CTE in XY/Z Axis | Alpha1 | TMA
| ppm/℃ | ≤60 | 38 |
Alpha2 | ppm/℃ | ≤300 | 165 | ||
50 - 260°C | % | ≤3.0 | 1.5 | ||
T300(Unclad) | TMA | Min | ≥30 | >120 | |
Specimen thickness: 0.8mm (1078 L1-Glass)